SuperBot-1 - Refurbished

Current recommendation - SuperBOT-II

SB-I
On backorder

SuperBOT-I is now replaced by SuperBOT-II and SuperBOT-III. Contact Xeltek for immediate assistance.

Highlights

  • High throughput, up to 1200 UPH
  • Four built-in SuperPro 5000 programmers.
    Throughput rate is 30 times faster than SuperBot-1 for eMMC devices.
  • Supports tray, tape and tube input and output
  • Supports laser and ink marking
  • Short change-over time
  • Intelligent software cuts learning curve and setup time while simplifying task management
  • Compact chassis design
  • CE and RoHS Compliant

Socket adapters sold separately.

To find the compatible adapter for your chip please visit our Device Search Tool.


DIP Socket Adapter: 

DX0001(SuperPro 6100N and SuperPro 6104NGP)

GX0001 (SuperPro 7500 and SuperPro 7504)

Expanded Features

  • The largest device support in the industry
  • Utilizes industrial personal computer (with control card inside).
  • Built-in servo and vision system mode to quickly and accurately locate and complete chip capture, placement, programming and packaging automatically.
  • Four built-in internal SuperPro 5000 modules. Efficiency is much higher than parallel-production programmers because each module burns chips independently.
  • Advantages:
    • Modularizing system design capability.
    • Improved switching time.
    • High throughput (1400 devices per hour).
    • Competitive quote.
  • Supports standard Tray & Tape Reel and Tube input & output for IC packages.

Motion

  • Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I.
  • Content High performance control card & servo drive system.
  • Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
  • Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
  • Pick & Place head placement accuracy (+/-) 0.08mm.

Vision System

  • Camera 400*400 pixels.
  • Vision resolution 0.1mm.
  • Process time per view ~0.5sec

I/O Devices

Tray : The standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray :This device includes Tray in and Tray out. Trays could be added or removed without stopping machine operation (up to 15 trays).
Tape-in Device : An input device for tapes with IC packaging. Devices must be modified for custom IC size.
Tape-out Device :An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device

Assisted Control

  • Built-in Control : PC-based control with Windows XP.
  • Display : LCD monitor.
  • Data entry : Keyboard & mouse

Software Download & Device List

Software Download Download Device List View Online Device List

 

Chirag Kapoor has been incredibly helpful with any questions that we have had in regards to our programming equipment. We have used Xeltek for the majority of our programming needs and the responsiveness of your technical services will continue to make Xeltek our first choice for programming.

Warranty Support

Standard 1 Year Warranty: Included with purchase of SuperBOT-I.

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Our goal is to have your engineers trained properly so that they can carry on without a problem. The Factory will set up an onsite set-up and training schedule in conjunction with the customer team.

 

Learn More About Our On-Site Installation

SuperBOT5: 1280(L)×840(W)×1500(H)mm Weight: 450Kg

SuperBOT 5e: 1260(L)×900(W)×1550(H)mm Weight: 248Kg.

Manual Tray (Standard equipped) Standard I/O device of the machine. Operator will replace the programmed tray from the SuperBot machine manually after the full tray is programmed. Customer does not need to buy any other accessory while using this option.

Auto Tray Device This device is an extension of the fixed tray. It includes tray-in and tray-out and users can put 20 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine. The auto tray device can also be installed outside of the whole machine and trays can be automatically changed without the need to open the upper cover, which saves tray changeover space and avoid human error during tray changeover. The auto tray device can stack up to 20 JEDEC trays. Watch video

Tape-In Device Electric Tape in feeder. Tape width between 8 and 32mm applicable. Tape-in device can be configured as per the chip to be programmed. For SOIC and TSOP packages customer will need 2-3 types of different tape in the devices depending on the width of chips to be programmed. Watch video

Tape-Out Device Connects to a SuperBOT2 or SuperBOT3 for fully automatic operation. 8-32 mm tape widths can be used with the device. Output reel is sealed with heated tape. Watch video

Tube-In Moves chips in the machine. Chip guider for different chip width (optional). IO is multi feed and upto 8 tubes can be operated at once (optional). Tube IO pages should also be updated accordingly.

Tube-Out Moves chips out of the machine. Chip guider for different chip width (optional). IO is multi feed and upto 8 tubes can be operated at once (optional). Tube IO pages should also be updated accordingly. Watch video

Laser Marker System An optional attachment to the tape-out or the auto tray device for high speed marking. It marks up to 4 characters on the passed chips. Watch video

Tape Ink-Marker Add-on item for tape out machine. On completion of programming the chip can be automatically marked with a point using ink (optional). Watch videoTray Ink Marker Add-on item for auto tray machine. On completion of the programming the chip can be automatically marked with a point using ink (optional). Watch video