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| (Thin small-outline package) |
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| (Plastic leaded chip carrier) |
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| (Small-outline integrated circuit) |
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| (Dual in-line package) |
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| (Ball grid array) |
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| (Thin Quad Flat Pack) |
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| (Shrink Dual Inline Package) |
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| (Shrink Small-Outline Package) |
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| (Quad Flat Package) |
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| (Pin grid array) |
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| (Small-outline J-leaded) |
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| (Quad Flat No leads) also known as MLF package) |
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| (Small Outline Non-Leaded Package) |
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| (Plastic Small-Outline Package) |
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| (Quadruple in-line package) |
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| (Small Outline Package) |
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| (Thin-Shrink Small Outline Package) |
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